For highest precision in multilayer technology: ILFA invests in DIS bonding system

And once again we have received new machinery for our production in Hanover. In the area of multilayer technology, we are now supported by an FLX bonding system from DIS. It enables pinless alignment of multilayers, rigid and rigid-flex PCBs. Two different processes take place in one unit: Layer-to-layer alignment and bonding of layers. This process eliminates the additional tolerances associated with pin lamination and thus helps us achieve more precision, especially for high layer multilayers.