And once again we have received new machinery for our production in Hanover. In the area of multilayer technology, we are now supported by an FLX bonding system from DIS. It enables pinless alignment of multilayers, rigid and rigid-flex PCBs. Two different processes take place in one unit: Layer-to-layer alignment and bonding of layers. This process eliminates the additional tolerances associated with pin lamination and thus helps us achieve more precision, especially for high layer multilayers.
We rely on a variety of recruiting channels and platforms to fill our vacant positions. One form of recruiting that smaller and medium-sized companies in particular should not ignore is the “employees recruit employees” program. From time to time, we also use this form of recruitment to fill vacant positions in our company.