One of our current projects is intended for use as a high-frequency application. The requirements are correspondingly high, which, in addition to high-frequency suitability, envisage a rigid-flex PCB design with four flexible layers. The via fill and backdrilling processes are also used.
A total of 16 students set off in mid-May with their professor and a research assistant to visit us at ILFA and take a close look at our production. The students from Leibniz Universität Hannover are enrolled on the nanotechnology degree programme, which they will complete with a Master of Science degree. Two of our colleagues were there exclusively for the students on the day, giving presentations, practical insights and, of course, a detailed tour of our production facilities.
On the sidelines of APEX 2024 in Anaheim, California, ILFA CEO Thomas Michels and Xaver Feiner (Vice President Marketing & Sales at Zollner Elektronik AG) were in conversation with Philip Stoten for SCOOP tv. Together, they outline the steps needed to ensure the resilience of the European supply chain.
The network is joining forces with an open letter, which is initially addressed to all member companies of the EIPC (European Institute for the PCB Community). In an urgent appeal to European government representatives to do more for domestic PCB manufacturers, the current situation of the PCB industry is highlighted and the importance of PCB as a basic technology is emphasised.