Technologie
ILFA puts new V-Bond system into operation
Our new V-Bond system significantly reduces the amount of manual handling required for multilayer PCBs. This also increases our capacity and quality in production.
Technologie
ILFA commissions RMV 125/6 lamination centre from LAUFFER
It is another important milestone in our modernisation offensive: with the commissioning of our new lamination centre from LAUFFER Pressen, we are tripling our lamination capacities in one fell swoop. The RMV 125/6 lamination centre forms the new heart of our multilayer department.
Technologie
Technologies and processes at ILFA: High-frequency printed circuit board with four flex layers
One of our current projects is intended for use as a high-frequency application. The requirements are correspondingly high, which, in addition to high-frequency suitability, envisage a rigid-flex PCB design with four flexible layers. The via fill and backdrilling processes are also used.
Technologie
Technologies and processes at ILFA: Sophisticated HDI design in PCB production
The requirement for high circuit densities in combination with short signal paths and low space requirements can be realised in PCB production with so-called HDI PCBs. HDI stands for “High Density Interconnect” and, as a relatively new technology, plays an important role for ILFA GmbH in the fulfilment of demanding customer requirements. In the following article, we present a sequential structure with 6 electrical layers. The customer requirement included 50 µm line/space on all layers, in combination with 300 µm BGA pitch on the outer layers, as well as a smallest pad diameter of 150 µm.
Technologie
Technologies and processes at ILFA: embedded resistors with OhmegaPly®
Structures on modern printed circuit boards are becoming smaller and smaller, materials are becoming thinner and thinner, and the number of pressings is constantly increasing. This requires certain technologies and processes to be able to meet the requirements of complex PCBs. This time in the spotlight: embedded resistors with OhmegaPly®.
Technologie
ILFA relies on inductively heated laminating press InduBond X-Press 360
At first there was only a large heavy-duty crane on our premises, then the truck arrived. And it was a big one: it brought our new InduBond X-Press 360 laminating press directly from Barcelona, Spain. With a weight of around 14 tonnes, a special team was needed to support us with the logistics: the company Schwarze Spezialtransporte has already supported us several times and once again did an excellent job with millimetre precision.
Technologie
InduBond press centre X-Press 360
The InduBond® X-Press is a revolutionary concept in multilayer press technology with unprecedented accuracy and precision.