Higher level of automation Pt. 2: LHMT delivers four more ROBI-FLEX 2×1 to ILFA

In mid-July, we had already received six ROBI-FLEX 2×1 loaders and unloaders from LHMT and integrated them into our production. Now, in September, the next delivery took place and another four of the handling devices were installed in our OFT (surface technology). This has further increased our degree of automation, because now loading and unloading is also fully automatic on our deburring machine and on the palladium line for direct metallisation.

ILFA at the B2Run company run in Hanover

The weather was perfect for running, the atmosphere was great and you could literally feel how eager the participants were to run together to the finish line. Around 10,000 runners from 410 companies were at the start when, after three years of interruption, they finally returned to the course around the Maschsee lake in the Heinz von Heiden stadium. Of course, we at ILFA didn’t want to miss out!

On the way to more automation: LHMT delivers six pieces of ROBI-FLEX 2×1

With the flexible automation concept ROBI-FLEX from LHMT, we get a bit more automation for our PCB production at ILFA. LHMT, a member of the Schmoll Maschinengruppe, has supplied and installed the first six loaders and unloaders for our production lines. Within just a few days, LHMT’s competent service technicians equipped us with the ROBI-FLEX handling devices for our tin and resist stripper as well as the acid etch, among other things.

ILFA commissions new plasma system: Boffotto P15V-E9

It’s another tick we can add to our investment planning: Our new plasma system was delivered and commissioned at the beginning of July. The Boffotto P15V-E9 is a “high volume” plasma processing system that processes rigid, flexible and rigid-flex PCBs at high speed. Hard-to-wet and hard-to-bond surfaces are activated, carbon residue or other contaminants in PCB holes are removed and inner layers are prepared for improved adhesion.

FED Working Group meets in Hanover at ILFA

The FED PCB Working Group, an association of industry experts from Germany and Austria, met for its 21st meeting this time at ILFA in Hanover. Exciting topics were on the agenda, such as dealing with UL certifications, annealing recommendations for flex and multi-layer PCBs or the further handling of a joint project on copper layer thicknesses.