Students from Leibniz Universität Hannover on an excursion to ILFA

A total of 16 students set off in mid-May with their professor and a research assistant to visit us at ILFA and take a close look at our production. The students from Leibniz Universität Hannover are enrolled on the nanotechnology degree programme, which they will complete with a Master of Science degree. Two of our colleagues were there exclusively for the students on the day, giving presentations, practical insights and, of course, a detailed tour of our production facilities.

Support for the domestic PCB industry: ILFA strongly supports EIPC initiative

The network is joining forces with an open letter, which is initially addressed to all member companies of the EIPC (European Institute for the PCB Community). In an urgent appeal to European government representatives to do more for domestic PCB manufacturers, the current situation of the PCB industry is highlighted and the importance of PCB as a basic technology is emphasised.

ILFA invests in new CF 200 high-vacuum plugging machine from I.T.C. Intercircuit

During the IPC APEX Expo 2024 in Anaheim, California, we awarded I.T.C. Intercircuit, one of the leading suppliers of equipment for the PCB industry, the contract for a new plugging machine. The CF 200 high-vacuum plugging machine is a real innovation: filling and cleaning take place in just one fully air-conditioned chamber, and through-holes and blind holes on both sides of the PCB are filled in a single operation.

Trade and in-house production of printed circuit boards: The best of both worlds at ILFA

The ILFA business model combines the best of both worlds for its customers: The in-house production of complex printed circuit boards in Hanover as well as the trade with printed circuit boards from controlled external production. Our Asian partners are personally qualified by our own local office in Shenzhen. Regular audits ensure consistent material quality and smooth production processes. From small batch sizes for samples to large series, we can fulfil any request. This makes us particularly interesting for all electronics companies that do not have their own contacts in Asia.

Technologies and processes at ILFA: Sophisticated HDI design in PCB production

The requirement for high circuit densities in combination with short signal paths and low space requirements can be realised in PCB production with so-called HDI PCBs. HDI stands for “High Density Interconnect” and, as a relatively new technology, plays an important role for ILFA GmbH in the fulfilment of demanding customer requirements. In the following article, we present a sequential structure with 6 electrical layers. The customer requirement included 50 µm line/space on all layers, in combination with 300 µm BGA pitch on the outer layers, as well as a smallest pad diameter of 150 µm.