Technologie
ILFA puts new V-Bond system into operation
Our new V-Bond system significantly reduces the amount of manual handling required for multilayer PCBs. This also increases our capacity and quality in production.
Technologie
ILFA commissions RMV 125/6 lamination centre from LAUFFER
It is another important milestone in our modernisation offensive: with the commissioning of our new lamination centre from LAUFFER Pressen, we are tripling our lamination capacities in one fell swoop. The RMV 125/6 lamination centre forms the new heart of our multilayer department.
Technologie
Technologies and processes at ILFA: High-frequency printed circuit board with four flex layers
One of our current projects is intended for use as a high-frequency application. The requirements are correspondingly high, which, in addition to high-frequency suitability, envisage a rigid-flex PCB design with four flexible layers. The via fill and backdrilling processes are also used.
Technologie
Technologies and processes at ILFA: Sophisticated HDI design in PCB production
The requirement for high circuit densities in combination with short signal paths and low space requirements can be realised in PCB production with so-called HDI PCBs. HDI stands for “High Density Interconnect” and, as a relatively new technology, plays an important role for ILFA GmbH in the fulfilment of demanding customer requirements. In the following article, we present a sequential structure with 6 electrical layers. The customer requirement included 50 µm line/space on all layers, in combination with 300 µm BGA pitch on the outer layers, as well as a smallest pad diameter of 150 µm.
Technologie
InduBond press centre X-Press 360
The InduBond® X-Press is a revolutionary concept in multilayer press technology with unprecedented accuracy and precision.