Multilayer

The requirement for high circuit densities in combination with short signal paths and low space requirements can be realised in PCB production with so-called HDI PCBs. HDI stands for “High Density Interconnect” and, as a relatively new technology, plays an important role for ILFA GmbH in the fulfilment of demanding customer requirements. In the following article, we present a sequential structure with 6 electrical layers. The customer requirement included 50 µm line/space on all layers, in combination with 300 µm BGA pitch on the outer layers, as well as a smallest pad diameter of 150 µm.