Almost EUR 8 million invested in ILFA’s PCB production

Over the past four years, we have invested almost EUR 8 million in our PCB production at our Hanover Anderten site. There have been innovations in almost every department, e.g. new machines and systems, clean room areas and new lighting, air conditioning and automation concepts. Our shutdown a few weeks ago marked an important milestone, as our new LAUFFER pressing centre was installed, which again involved extensive conversion work. This work has now also been completed and our production facility is modern, bright and ergonomic for employees and visitors alike.

ILFA and other industry representatives from Lower Saxony visit Lower Saxony’s Economics Minister Olaf Lies

In mid-February 2024, a delegation of high-profile business representatives accepted the invitation from Lower Saxony’s Minister for Economic Affairs, Construction, Transport and Digitalisation, Olaf Lies, to discuss current economic issues. The guest house of the Lower Saxony state government in Hanover provided an appropriate setting to jointly develop requirements for a resilient Lower Saxony economy.

Trainees to become electrical engineering assistants (ETA) develop their own circuit board layout at ILFA

Training to become an electrotechnical assistant is a two-year, initial vocational training programme that is conducted at a vocational school and includes a four-week internship. Our two trainees Johanna and Nikola attend the Berufsbildende Schule Metalltechnik – Elektrotechnik (bbs-me) of the Hanover region for the training and have each secured a traineeship at ILFA. There they learn everything about the production of the printed circuit board and design their own printed circuit board layout for their project work.

ILFA Kirchheimbolanden branch celebrates together at the 71st Residence Festival

The 71st Residenzfest took place in Kirchheimbolanden in mid-August. The wine festival, in the ambience of the historic towers and city walls, was awarded the title of the most beautiful wine festival in the Palatinate in 2017. The employees of ILFA’s Kirchheimbolanden branch did not want to miss out on this festivity and celebrated there with colleagues from TCLAD Europe and Brain4PCB.

For highest precision in multilayer technology: ILFA invests in DIS bonding system

And once again we have received new machinery for our production in Hanover. In the area of multilayer technology, we are now supported by an FLX bonding system from DIS. It enables pinless alignment of multilayers, rigid and rigid-flex PCBs. Two different processes take place in one unit: Layer-to-layer alignment and bonding of layers. This process eliminates the additional tolerances associated with pin lamination and thus helps us achieve more precision, especially for high layer multilayers.