ILFA and other industry representatives from Lower Saxony visit Lower Saxony’s Economics Minister Olaf Lies

In mid-February 2024, a delegation of high-profile business representatives accepted the invitation from Lower Saxony’s Minister for Economic Affairs, Construction, Transport and Digitalisation, Olaf Lies, to discuss current economic issues. The guest house of the Lower Saxony state government in Hanover provided an appropriate setting to jointly develop requirements for a resilient Lower Saxony economy.

Trainees to become electrical engineering assistants (ETA) develop their own circuit board layout at ILFA

Training to become an electrotechnical assistant is a two-year, initial vocational training programme that is conducted at a vocational school and includes a four-week internship. Our two trainees Johanna and Nikola attend the Berufsbildende Schule Metalltechnik – Elektrotechnik (bbs-me) of the Hanover region for the training and have each secured a traineeship at ILFA. There they learn everything about the production of the printed circuit board and design their own printed circuit board layout for their project work.

ILFA Kirchheimbolanden branch celebrates together at the 71st Residence Festival

The 71st Residenzfest took place in Kirchheimbolanden in mid-August. The wine festival, in the ambience of the historic towers and city walls, was awarded the title of the most beautiful wine festival in the Palatinate in 2017. The employees of ILFA’s Kirchheimbolanden branch did not want to miss out on this festivity and celebrated there with colleagues from TCLAD Europe and Brain4PCB.

For highest precision in multilayer technology: ILFA invests in DIS bonding system

And once again we have received new machinery for our production in Hanover. In the area of multilayer technology, we are now supported by an FLX bonding system from DIS. It enables pinless alignment of multilayers, rigid and rigid-flex PCBs. Two different processes take place in one unit: Layer-to-layer alignment and bonding of layers. This process eliminates the additional tolerances associated with pin lamination and thus helps us achieve more precision, especially for high layer multilayers.

FED Working Group meets in Hanover at ILFA

The FED PCB Working Group, an association of industry experts from Germany and Austria, met for its 21st meeting this time at ILFA in Hanover. Exciting topics were on the agenda, such as dealing with UL certifications, annealing recommendations for flex and multi-layer PCBs or the further handling of a joint project on copper layer thicknesses.