For highest precision in multilayer technology: ILFA invests in DIS bonding system

And once again we have received new machinery for our production in Hanover. In the area of multilayer technology, we are now supported by an FLX bonding system from DIS. It enables pinless alignment of multilayers, rigid and rigid-flex PCBs. Two different processes take place in one unit: Layer-to-layer alignment and bonding of layers. This process eliminates the additional tolerances associated with pin lamination and thus helps us achieve more precision, especially for high layer multilayers.

FED Working Group meets in Hanover at ILFA

The FED PCB Working Group, an association of industry experts from Germany and Austria, met for its 21st meeting this time at ILFA in Hanover. Exciting topics were on the agenda, such as dealing with UL certifications, annealing recommendations for flex and multi-layer PCBs or the further handling of a joint project on copper layer thicknesses.

ILFA GmbH announces system partnership with Atotech

For its expansion plans, the Hanover-based PCB producer ILFA relies on the expertise of the respective industry leaders. In the field of wet chemistry and electroplating, the specialist Atotech has now been acquired. The Berlin-based company is one of the world’s leading suppliers of special chemical processes and equipment for the printed circuit board, chip carrier and semiconductor industries and is distinguished by its excellent support and services, among other things.

ILFA at the NORTEC trade fair in Hamburg

The 2022 trade fair season is in full swing. After visiting SMTconnect in Nuremberg in mid-May, ILFA will head to Hamburg at the end of May to exhibit at NORTEC. The four-day trade fair from 31 May to 3 June 2022 will present forward-looking technologies, innovative manufacturing solutions and the top issues in the production industry. ILFA will be located on the joint stand Electronics Manufacturing in Hall A1, Stand 510E.