Technologie
ILFA puts new V-Bond system into operation
Our new V-Bond system significantly reduces the amount of manual handling required for multilayer PCBs. This also increases our capacity and quality in production.
Allgemeines
Almost EUR 8 million invested in ILFA’s PCB production
Over the past four years, we have invested almost EUR 8 million in our PCB production at our Hanover Anderten site. There have been innovations in almost every department, e.g. new machines and systems, clean room areas and new lighting, air conditioning and automation concepts. Our shutdown a few weeks ago marked an important milestone, as our new LAUFFER pressing centre was installed, which again involved extensive conversion work. This work has now also been completed and our production facility is modern, bright and ergonomic for employees and visitors alike.
Technologie
ILFA commissions RMV 125/6 lamination centre from LAUFFER
It is another important milestone in our modernisation offensive: with the commissioning of our new lamination centre from LAUFFER Pressen, we are tripling our lamination capacities in one fell swoop. The RMV 125/6 lamination centre forms the new heart of our multilayer department.
Allgemeines
New addition to the machine park: ILFA invests in Schmoll drilling and milling machine A-RMXY2-60S-CCD
Our latest addition to our machinery and equipment is used in our department for drilling and milling technology (BFT): The A-RMXY2-60S-CCD from Schmoll Maschinen GmbH. With its performance and equipment, the drilling and milling machine is also a real high-end solution in other respects. We are only the second PCB manufacturer in Europe to use this machine with numerous additional applications in production.
Allgemeines
For highest precision in multilayer technology: ILFA invests in DIS bonding system
And once again we have received new machinery for our production in Hanover. In the area of multilayer technology, we are now supported by an FLX bonding system from DIS. It enables pinless alignment of multilayers, rigid and rigid-flex PCBs. Two different processes take place in one unit: Layer-to-layer alignment and bonding of layers. This process eliminates the additional tolerances associated with pin lamination and thus helps us achieve more precision, especially for high layer multilayers.
Allgemeines
New addition to ILFA’s machine park: UCE DES line
The latest addition to our machine park required a total of three overseas containers, which were delivered and unloaded within one day. You could already guess that the new wet machine would be big, and that’s how it turned out: The DES line from the Asian manufacturer UCE has a total length of 23 meters. We had previously carried out some conversion work in the area so that the line could be optimally integrated into our production.
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Higher level of automation Pt. 2: LHMT delivers four more ROBI-FLEX 2×1 to ILFA
In mid-July, we had already received six ROBI-FLEX 2×1 loaders and unloaders from LHMT and integrated them into our production. Now, in September, the next delivery took place and another four of the handling devices were installed in our OFT (surface technology). This has further increased our degree of automation, because now loading and unloading is also fully automatic on our deburring machine and on the palladium line for direct metallisation.
Allgemeines
On the way to more automation: LHMT delivers six pieces of ROBI-FLEX 2×1
With the flexible automation concept ROBI-FLEX from LHMT, we get a bit more automation for our PCB production at ILFA. LHMT, a member of the Schmoll Maschinengruppe, has supplied and installed the first six loaders and unloaders for our production lines. Within just a few days, LHMT’s competent service technicians equipped us with the ROBI-FLEX handling devices for our tin and resist stripper as well as the acid etch, among other things.
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ILFA commissions new plasma system: Boffotto P15V-E9
It’s another tick we can add to our investment planning: Our new plasma system was delivered and commissioned at the beginning of July. The Boffotto P15V-E9 is a “high volume” plasma processing system that processes rigid, flexible and rigid-flex PCBs at high speed. Hard-to-wet and hard-to-bond surfaces are activated, carbon residue or other contaminants in PCB holes are removed and inner layers are prepared for improved adhesion.
Allgemeines
New addition at ILFA: Impex measuring machine proX3
As part of our modernization offensive, we are currently making numerous investments in personnel, equipment and machinery. Our latest addition is the Impex proX3, an ergonomic measuring machine with a high-precision CCD metrology measuring system.